Simulation » Feature Description » Solvers

Solvers


Solvers

  • Yee-FDTD (standard fast FDTD solver, 20/40 MCells/s on P4 3.4 GHz
  • ADI-FDTD (ADI-FDTD solver)
  • C-FDTD (FIT / conformal FDTD solver)
  • C-ADI-FDTD (combined ADI and FIT / conformal FDTD solver)
  • T (Thermal solver)
  • C-T (conformal Thermal solver)
  • EM-T (coupled EM Thermal solver, conformal)
  • LF solver
  • Circuit-EM Simulation


Multi Processor Packages

  • Cluster OpenMP for Linux (Coming Soon)
  • Improved openMP shared memory parallelization for all above mentioned


Network Features

  • Remote simulation tools with simulating queing
  • Batch demon, queuing control instances
  • Solver control via SEMCAD X GUI or cmd line or Python scripting
  • Database engine for sharing and managing projects


Solver Features

  • FDTD Solvers
    -Transient, Broadband and Harmonic simulations
    - Results from time and frequency domain
    - 32/64 bit, Win/Linux/OSX/UNIX
    - Automatic or manual simulation termination
    - Non-homogeneous intelligent gridder engine (geometry detection)
    - Run-time monitoring of I(t) and V(t)
    - Lossy dielectric and magnetic materials
    - Frequency-dependent dielectric and magnetic materials (Debye,
    Lorentz, Drude, Drude-Lorentz)
    - Metamaterials (double negative)
    - Non-linear materials (Kerr-Effect, Raman-Scattering)
    - Lossy real metals, thin metal sheets and coatings
    - Temperature relevant parameters for T and EM-T solver
    - Huge predefined materials database (metals, dielectrics, anatomical)
    - User defined signals source (pulse, step, saw, arbitrary, etc.)
    - Discrete sources (1-D, single edge)
    - Waveguide sources (2-D, excitation on planes)
    - Plane-wave and Huygens’ box sources (total-field / scattered-field)
    - Hard added voltage and current sources (with series/parallel RLC)
    - Lumped elements (R, L, C, predefined serial/parallel)
    - More complex elements through CIRCUIT-EM Simulation
    - ABC, PEC, PMC, periodic boundaries
    - Analytic boundaries (Mur, Higdon)
    - UPML and CPML boundaries with adjustable absorption

  • Special/Additional EM Conformal Solver Features
    - Separate treatment of metals
    - Improved treatment of dielectrics (compared to original conformal)
    - User defined speed/accuracy tradeoff
    - Unconditionally stable and robust for arbitrarily complex structures
    - Smooth integration with conformal gridder/voxeler

  • Thermal Solver Features
    - T standalone solver
    - Coupled EM-T, extended Pennes Bioheat Equation for BioEM
    - Discrete vessel model for BioEM
    - Multiple EM sources (not bound to single simulation)
    - Correlated/uncorrelated superposition of fields, individual scaling
    - Pulsed excitation/time profile, on-off switch
    - T dependent tissues (electric conductivity , SAR, blood perfusion)
    - Time dependent specific heat generation rates
    - Tensorial heat diffusion
    - Conformal subcell T solver
    - Flexible boundary-conditions (Neumann, Dirichlet, mixed, for every interface and every direction)
    - Extended T solver functionality (field optimization extended features)
    - Thermal ablation (tissue damage) measure

  • Circuit-EM Simulation
    - Coupled circuit (SPICE)-EM simulation in time-domain
    - Full integration/coupling with SEMCAD X EM simulator
    - Circuit/layout design environment
    - Import of components, subcircuits (Coming soon)
    - Interfaces to other circuit simulation packages (Coming soon)
    - Hardware acceleration compatible

  • LF Solvers
    - Windows 32/64 bit
    - Automatic simulation termination
    - Electrostatic and Electro quasi-static
    - Magnetostatic and Magneto quasi-static with constant permeability
    - 3D static solver
    - 3D LF solvers, E/H integrated into SEMCAD X
    - Coupled with Thermal solvers


 
© 2008 by SPEAG, Schmid & Partner Engineering AG, CH-8004 Zurich, Switzerland | SitemapContact | Login