Simulation »
Feature Description »
Solvers
Solvers
Solvers
- Yee-FDTD (standard fast FDTD solver, 20/40 MCells/s on P4 3.4 GHz
- ADI-FDTD (ADI-FDTD solver)
- C-FDTD (FIT / conformal FDTD solver)
- C-ADI-FDTD (combined ADI and FIT / conformal FDTD solver)
- T (Thermal solver)
- C-T (conformal Thermal solver)
- EM-T (coupled EM Thermal solver, conformal)
- LF solver
- Circuit-EM Simulation
Multi Processor Packages
- Cluster OpenMP for Linux (Coming Soon)
- Improved openMP shared memory parallelization for all above mentioned
Network Features
- Remote simulation tools with simulating queing
- Batch demon, queuing control instances
- Solver control via SEMCAD X GUI or cmd line or Python scripting
- Database engine for sharing and managing projects
Solver Features
- FDTD Solvers
-Transient, Broadband and Harmonic simulations
- Results from time and frequency domain
- 32/64 bit, Win/Linux/OSX/UNIX
- Automatic or manual simulation termination
- Non-homogeneous intelligent gridder engine (geometry detection)
- Run-time monitoring of I(t) and V(t)
- Lossy dielectric and magnetic materials
- Frequency-dependent dielectric and magnetic materials (Debye,
Lorentz, Drude, Drude-Lorentz)
- Metamaterials (double negative)
- Non-linear materials (Kerr-Effect, Raman-Scattering)
- Lossy real metals, thin metal sheets and coatings
- Temperature relevant parameters for T and EM-T solver
- Huge predefined materials database (metals, dielectrics, anatomical)
- User defined signals source (pulse, step, saw, arbitrary, etc.)
- Discrete sources (1-D, single edge)
- Waveguide sources (2-D, excitation on planes)
- Plane-wave and Huygens’ box sources (total-field / scattered-field)
- Hard added voltage and current sources (with series/parallel RLC)
- Lumped elements (R, L, C, predefined serial/parallel)
- More complex elements through CIRCUIT-EM Simulation
- ABC, PEC, PMC, periodic boundaries
- Analytic boundaries (Mur, Higdon)
- UPML and CPML boundaries with adjustable absorption - Special/Additional EM Conformal Solver Features
- Separate treatment of metals
- Improved treatment of dielectrics (compared to original conformal)
- User defined speed/accuracy tradeoff
- Unconditionally stable and robust for arbitrarily complex structures
- Smooth integration with conformal gridder/voxeler - Thermal Solver Features
- T standalone solver
- Coupled EM-T, extended Pennes Bioheat Equation for BioEM
- Discrete vessel model for BioEM
- Multiple EM sources (not bound to single simulation)
- Correlated/uncorrelated superposition of fields, individual scaling
- Pulsed excitation/time profile, on-off switch
- T dependent tissues (electric conductivity , SAR, blood perfusion)
- Time dependent specific heat generation rates
- Tensorial heat diffusion
- Conformal subcell T solver
- Flexible boundary-conditions (Neumann, Dirichlet, mixed, for every interface and every direction)
- Extended T solver functionality (field optimization extended features)
- Thermal ablation (tissue damage) measure - Circuit-EM Simulation
- Coupled circuit (SPICE)-EM simulation in time-domain
- Full integration/coupling with SEMCAD X EM simulator
- Circuit/layout design environment
- Import of components, subcircuits (Coming soon)
- Interfaces to other circuit simulation packages (Coming soon)
- Hardware acceleration compatible - LF Solvers
- Windows 32/64 bit
- Automatic simulation termination
- Electrostatic and Electro quasi-static
- Magnetostatic and Magneto quasi-static with constant permeability
- 3D static solver
- 3D LF solvers, E/H integrated into SEMCAD X
- Coupled with Thermal solvers



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